Cambodia and Japan are going to sign loan agreements worth nearly JPY 26 billion (equivalent to over US$188 million) on road connectivity and water supply in Phnom Penh on June 20, said a press release of the Ministry of Foreign Affairs and International Cooperation (MFAIC).

Cambodian Deputy Prime Minister, Minister of MFAIC H.E. PRAK Sokhonn and Japanese Ambassador to Cambodia H.E. UENO Atsushi will co-sign the Exchange of Notes and accompanying documents on the loans, it said.

Of the total amount, the source pointed out, almost JPY 23.7 billion (equivalent to approximately US$173 million) will be used for the implementation of the Rural Road Connectivity Improvement Project; and the rest, more than JPY 2 billion (equivalent to approximately US$15 million), for the implementation of the Siem Reap Water Supply Expansion Project (III).

“The allocation of the said assistance underscores Japan’s unwavering commitment to supporting the Cambodian government’s continuous efforts in fostering socio-economic development. This extension also contributes to reinforcing the enduring relations and close cooperation between the two countries, which have recently elevated their bilateral relationship to the ‘Comprehensive Strategic Partnership’ while commemorating the 70th anniversary of their diplomatic ties,” the press release underlined.

Source: Agence Kampuchea Presse